GALVANIC PLATING DEVICE OF A HORIZONTAL GALVANIC PLATING PROCESSING LINE FOR GALVANIC METAL DEPOSITION AND USE THEREOF

摘要

The present invention relates to galvanic plating devices of galvanic metal, in particular copper, horizontal galvanic plating processing lines for deposition; Wherein the galvanic plating device comprises at least a first galvanic plating module arranged below the transport level of the substrate to be treated, and at least a plating clamp arranged on the first side of the galvanic plating device; The first galvanic plating module includes at least an electrolyte nozzle and at least an anode element inside the galvanic plating module, wherein the galvanic plating module has at least a covering plate having a plurality of openings arranged over the anode element and the electrolyte nozzle. Wherein the galvanic plating device further comprises at least a substrate guide element arranged on a surface of the covering plate of the galvanic plating module, wherein the substrate guide element is associated with the surface of the covering plate of the galvanic plating module. . The invention also relates to the use of such galvanic plating devices for deposition of galvanic metal, preferably copper, on printed circuit foils, flexible printed circuit boards and embedded chip substrates.