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A Radiation Hardened 512 kbit SRAM in 180 nm CMOS Technology

机译:180nm CMOS技术的辐射硬化512 kbit sram

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A 512 kbit static random access memory has been designed and fabricated in a single-poly, six-metal 180 nm CMOS technology, with 1.8 V supply. The circuit has been designed to be radiation hard. The basic memory cell is a six transistor cell with a Miller capacitor between the internal latch nodes, to mitigate single event upset. Architectural and circuital solutions are also proposed to mitigate transient propagation and functional interrupts due to single events. Edge-less transistors were used to avoid damaging effects due to total dose. Guard rings and a large numbers of substrate and n-well contacts were placed to mitigate single event latch-up. A layout-oriented simulation technique has been used to estimate the cell sensitivity to single event effects. Measurements on silicon prototypes demonstrate that the memory is functional, with a write delay time equal to 13.7 ns and a read delay time equal to 18.5 ns. Post-irradiation measurements confirm that the 512 kbit SRAM is rad-hard up to 2 Mrad of Total Ionizing Dose (TID).
机译:512 KBit静态随机存取存储器设计和制造在单多,六金属180nm CMOS技术中,提供1.8 V供电。该电路设计成辐射。基本存储器单元是一个六个晶体管单元,内部锁存节点之间的米电容器,以减轻单个事件镦粗。还提出了建筑和电路解决方案,以减轻由于单个事件引起的瞬态传播和功能中断。使用边缘晶体管用于避免由于总剂量引起的损害效应。放置保护环和大量基板和n阱触点以减轻单个事件闩锁。面向布局的仿真技术已被用于估计对单个事件效果的细胞敏感性。硅原型的测量结果表明存储器是功能的,写入延迟时间等于13.7 ns和读取延迟时间等于18.5ns。后辐射测量结果证实,512 Kbit SRAM是全电离剂量(TID)的rad-Cly-2mrad。

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