assembling; copper; electronics packaging; lead bonding; reliability; 2D axisymmetry model; CPI; Cu; TCB process modeling methodology; assembly process; chip-package interaction reliability; conventional C4 bump; conventional flip chip technology; copper pillar design; copper pillar joint; copper pillar technology; copper-low-k chip; fine pitch copper pillar assembly; global-local technique; low-k stress; miniaturization requirements; package geometry; package warpage reduction; packaging material selection; reflow process; temperature loading; thermo-compression bonding process; wire bonding; Assembly; Bonding; Joints; Load modeling; Stress; Substrates;
机译:铜基板焊盘金属化的铜柱倒装芯片焊点的电迁移可靠性和形貌
机译:铜基板焊盘金属化的铜柱倒装芯片焊点的电迁移可靠性和形貌
机译:Cu / Low-k多层互连的芯片封装相互作用的应力分析
机译:Cu Pillar接头在低k芯片上的芯片包相互作用可靠性综合研究
机译:倒装芯片焊点可靠性的研究。
机译:检查者间诊断颈柱增生(CPH)的可靠性以及CPH与脊柱变性关节疾病(DJD)的相关性
机译:芯片组件焊接接头可靠性设计方法(第二报告)(回流工艺变化对焊点疲劳寿命的影响)
机译:使用sRs软件的无铅芯片电阻器,芯片电容器和铁氧体片式电感器的焊点可靠性预测