MOSFET; bonding processes; ceramics; flip-chip devices; heat sinks; silicon compounds; silver; sintering; 3-phase DMOSFET power module; DBC; SiC; air cooling conditions; ceramic based copper fins; cooling conditions; die metallization size; direct bonding copper; dual side liquid cooling; flip chip attach; flip chip bonding layer; heat sink thermal interface materials; operation requirements; power 960 W; power cycling simulation; sintering silver; switching speed; temperature 150 degC; thermal assembly layers; thermal management challenge; thermal modeling; thermal performance; working temperature; Bonding; Heat sinks; Multichip modules; Silicon carbide; Thermal conductivity; Thermal resistance;
机译:通过结合先进的冷却技术和高导热材料开发高导热率SiC功率模块
机译:突破液体冷却的局限性:动力模块直接液体冷却系统的设计与分析
机译:液氮冷却下低温功率模块的数值热模拟
机译:空气冷却和液体冷却条件下SiC电源模块的热建模和表征
机译:有效汽车动力总成的冷却策略:3D热建模和将热电模块集成到质子交换膜燃料电池堆中的多面体方法。
机译:膜辅助辐射冷却用于在没有空调的情况下在全球范围内扩展热舒适区
机译:考虑多层热耦合和不同加热/冷却条件的大功率模块三维热阻模型
机译:碳化硅(siC)电力电子和激光棒的热增强:液冷电力电子散热器的统计设计优化。