aluminium; cleaning; etching; micromechanical devices; ACT690S; ASP chamber; ATMI; Advanced Technology Materials Incorporated; Air Products; Al; Centura etch platform; DPS; DuPont; EKC265; MEMS structures; NE14; ST250; advanced strip and passivation chamber; aluminum interconnects; corrosion prevention; decoupled plasma source; formulated organic solvent cleaners; integrated circuit fabrication; metal etch chamber; plasma photoresist strip; post etch cleaning; post etch metal corrosion; post etch residues removal; process conditions; single wafer cleaning environment; solvent chemistries; total immersion environment; Chemicals; Cleaning; Corrosion; Films; Solvents; Surface treatment;
机译:无机酸蚀刻后清洗机理及原理
机译:无机酸柱清洗机理和原理
机译:使用有机溶剂和添加剂结合物理力去除蚀刻后光刻胶和侧壁残留物
机译:使用配方有机溶剂清洁剂对MEMS结构的铝柱清洁比较
机译:海岸线清洁剂的毒性比较在草虾(Palaemonetes Pugio)的两个生命阶段中加速了SWA和PES-51的清洁度。
机译:具有减小的特征尺寸和干净的刻蚀阻挡层结构的增强型a-IGZO TFT可靠性
机译:无机酸清洗后蚀刻铝的机理和原理
机译:含水碱性清洁剂:有机溶剂的替代品。