【24h】

Fused Silica Fine Grinding with Low Roughness

机译:低粗糙度熔融石英细磨

获取原文

摘要

Lithography-optics is one of the most complex optical systems. The fine grinding process is the most important step before polishing. Roughness and sub-surface damage (SSD) are essential outputs of fine grinding. We demonstrate the method that use fix abrasive cup tool with CNC grinding machine to complete the fine grinding process, even instead of lapping process. And experiment sample roughness can reach 23.40nm rms and Ra 18.554nm. The SSD estimate is about 2 μm which is also smaller than commercial lapping process. The fine grinding output can satisfy the lithography optic fabrication demands and efficiently reduce the polishing time.
机译:光刻光学是最复杂的光学系统之一。精磨工艺是抛光前最重要的步骤。粗糙度和亚表面损伤(SSD)是精磨的重要输出。我们演示了使用固定磨杯工具和CNC磨床来完成精磨过程的方法,甚至代替了精磨过程。实验样品的粗糙度可以达到23.40nm rms和Ra 18.554nm。 SSD估计约为2μm,也小于商用研磨工艺。精细的研磨输出可以满足光刻光学器件的制造需求,并有效地减少了抛光时间。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号