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Next promising P-Type FinFET devices without or with cobalt-silicide applied to the gate

机译:下一个有前途的p型FinFET器件,没有涂在栅极的钴 - 硅化物

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The leakage current is suppressed on 3-D structural fin-like channels of FinFET as the sizes of devices get substantially shrunk. The devices with channel width/length (0.12μm/ 0.10μm) are focused on and the baseline device is taken to be 15KeV phosphorous ions (the precursor PH3) for N-well Vt implant and heavily doped poly-silicon for the gate. One is thus intrigued in what if the Vt implant energy is changed to 20KeV or the gate poly-silicon is fully replaced with cobalt silicide.
机译:由于设备的尺寸基本上缩小,在FinFET的3-D结构翅状通道上抑制了漏电流。 具有通道宽度/长度的装置(0.12μ m / 0.10μ m),并且基线装置被认为是15kev磷离子(前体pH 3 ) N-Well VT植入物和重掺杂的聚硅用于浇口。 因此,如果VT植入能改变为20KeV或栅极聚硅完全用硅化物完全替换,则呼吸一个。

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