Vertical signal feedthrough for sandwich devices based on anodic bonding and after laser trimming

摘要

This paper reports a novel, low-cost and inherently simple vertical signal transmission method for glass-silicon-glass sandwich micro-electro-mechanical systems (MEMS) gyroscopes based on heavily doped silicon-bridge. As for the fabrication technique, only glass-to-silicon anodic bonding and after-laser-trimming process are needed, which are fully compatible with standard MEMS technology. Micro gyroscopes based on this optimized strategy were fabricated and experimental results showed that the proposed strategy for vertical signal transmission could be successfully integrated with MEMS devices and potentially be used in wafer level hermetic sealing.