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Carrier Backscattering Characteristics of Strained N-MOSFET Featuring Silicon-Carbon Source/Drain Regions

机译:具有硅 - 碳源/漏极区的应变N-MOSFET的载体反向散射特性

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The physics of carrier transport in a sub-90nm strained SOI n-MOSFET with silicon-carbon (SiC) source/drain (S/D) regions is investigated for the first time. Significant improvement in carrier backscattering coefficient r{sub}(sat) and source injection velocity v{sub}(inj) accounts for the large drive current I{sub}(Dsat) enhancement in SiC S/D transistors. The improvement in r{sub}(sat) is attributed to the modulation of conduction band barrier which results in a shorter critical length for carrier backscattering. On the other hand, strain-induced conduction band valley splitting leads to a reduced electron effective mass and thus contributes to the v{sub}(inj) enhancement. In addition, we evaluate the dependence of drive current performance on carrier injection velocity and ballistic efficiency in a short channel MOSFET.
机译:第一次研究了具有硅 - 碳(SiC)源/漏极(S / D)区的亚90nm条带SOI N-MOSFET中的载流子传输的物理学。载波反向散射系数R {SUB}(SAT)和源注射速度V {SUB}(INJ)对SIC S / D晶体管中的大驱动电流I {SUB}(DSAT)增强的源注射速度V {SUB}(INJ)的显着改进。 R {Sub}(SAT)的改进归因于导电带屏障的调制,这导致载波反向散射的缩小长度较短。另一方面,应变诱导的导带谷分离导致减少的电子有效质量,从而有助于V {Sub}(Inj)增强。此外,我们评估驱动电流性能对短沟道MOSFET中的载波注射速度和弹道效率的依赖性。

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