Exploration of the Possibilities of Low Temperature Soldering Alloy LMPA at Selective Wave Soldering (SWS)

摘要

The report provides the results of exploring the capabilities of low melting point alloy LMPA [1] with Selective Wave Soldering (SWS) [2], [3]. Typical of this study is that a comparison is made between the commonly used solder alloy SN 100 and the LMPA based on the requirements of the standards [4, 5] and the business. The test results of this new solder [6], [7], [8], [9], [10], [11] were checked and completed [I2]. The real comparative results are given in terms of quality, possibilities, efficiency and effectiveness. Various critical product applications have been investigated. The experiments were carried out using a modern machine for selective soldering on sophisticated products, which is a guarantee for correct and stable results. Conclusions have been made that allow this study to be used for solutions and improvements as well as for future development. The results of this study can be used as a basis for generating of design rules.