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A rigorous mathematical formulation to Automated Wet-Etch Station scheduling with multiple material-handling robots in Semiconductor Manufacturing Systems

机译:具有多种材料处理系统中的多种材料处理机器人的自动湿法站的严格数学制剂

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摘要

Track systems have been increasingly utilized in many different stages in the Semiconductor Industry. Most of the manufacturing processes, particularly those executed in the wafer fabrication, require these transportation devices to perform the transfers of wafers lots through several process steps. Since these process steps only produce one lot at a time in a single bath, the number of transfer operations between consecutive baths increases drastically with the number of steps and lots in the system. Therefore, the problem to be tackled in this work aims at finding the efficient structure and operation strategy of a particular track system working in an Automated Wet-Etch Station (AWS). A rigorous mathematical formulation (MILP) for the simultaneous scheduling and design of the AWS is developed in order to minimize the residence time of wafer lots in the system, providing at the same time a better utilization of track's resources.
机译:轨道系统越来越多地利用了半导体行业的许多不同阶段。大多数制造过程,特别是在晶片制造中执行的制造过程,需要这些运输装置通过几个工艺步骤来执行晶片批次的转移。由于这些过程步骤在单个浴中仅产生了批次,因此连续浴槽之间的传输操作的数量随着系统中的步数和批次而增加。因此,在本工作中要解决的问题旨在找到在自动湿蚀刻站(AWS)中工作的特定轨道系统的有效结构和操作策略。开发了一个严格的数学制定(MILP),用于同时调度和AWS的设计,以最大限度地减少系统中晶片批次的停留时间,同时提供轨道资源的相同利用率。

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