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Semi-analytical analysis for optimization of 0.1-/spl mu/m InGaAs-channel MODFETs with emphasis on on-state breakdown and reliability

机译:半分析分析0.1- / SPL MU / M Ingaas-andmodFET的优化,重点强调导通栏杆和可靠性

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We have measured and analyzed the bias limitations of our 0.1-/spl mu/m In/sub 53/Ga/sub 47/As-channel MODFETs. A semi-analytical model allows us to correlate a major degradation mechanism, the increase in drain resistance to impact ionization in the narrow-bandgap channel. We find, as others have, that this mechanism also determines the on-state breakdown voltage BV/sub DS//sup (on)/, and thus limits the operating regime. The modeling predicts the shape of BV/sub DS//sup (on)/ vs. I/sub D/ and shows that the off-state breakdown voltage is irrelevant for practical load-lines. BV/sub DS//sup (on)/(I/sub D/) deviates markedly from a constant power locus. In fact, it tends to have a flat minimum BV/sub DS//sup (on,min)/ (corresponding to maximum impact ionization current) near the I/sub D/ of maximum transconductance. BV/sub DS//sup (on,min)/ becomes the most significant measure of FET breakdown. Most of our device variations have tended to produce a constant-power trade-off of BV/sub DS//sup (on,min)/ with its associated I/sub D/, in contrast to the non-constant-power locus of BV/sub DS//sup (on)/(I/sub D/) The model predicts both trends well.
机译:我们已经测量并分析了我们的0.1- / SPL MU / M IN / SUM 53 / GA / SUB 47 / AS-Channel MODFET的偏差限制。半分析模型使我们能够与窄带隙通道中的漏极电离的漏极电阻的增加来关联重大的降解机制。我们发现,就像其他人一样,这种机制也决定了导通状态击穿电压BV / SUB DS // SUP(ON)/,因此限制了操作状态。该建模预测BV / SUB DS // SUP(ON)/ vs.I / SUB D /的形状,并表示实际载荷线的断开状态击穿电压是无关的。 BV / sub DS // SUP(ON)/(I / SUB D /)从恒定的电源基因座偏离显着偏离。实际上,它倾向于在I / SUM D /最大跨导附近具有扁平的最小BV / SUB DS / SUP(ON,MIN)/(对应于最大碰撞电离电流)。 BV / sub DS // SUP(ON,MIN)/成为FET分解的最显着衡量标准。我们的大多数设备变化都倾向于产生BV / Sub DS // Sup(ON,MIN)/与其相关联的I / SUB D /,与非恒定电源轨迹相反BV / sub DS // SUP(ON)/(I / SUB D /)模型预测趋势良好。

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