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A batch study of trace metal impurities in high-k semiconductor precursors CFM: Contamination free manufacturing

机译:高K半导体前体痕量金属杂质的分批研究CFM:污染自由制造

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Advanced electronic materials called precursor molecules are designed for the deposition of thin films that are expected to be reliable, contamination free and pristine. Deleterious effects of metallic contamination have been demonstrated in dielectric properties of thermal oxides grown on silicon [1]. In order to achieve ultra-high purity products, essentially free from trace metals (TM) and organic impurities, they need to be fully qualified. Upfront, TM analysis allows detection, identification and quantification of these contaminants to help control the quality of these precursors thus making them the preferred candidates for atomic layer deposition of high-k materials as storage capacitors in DRAM applications, or gate stacks of MOS-transistors. In this paper, we will demonstrate the inherent variability of trace metal concentrations in precursors, that necessitates the quantification for evaluation, qualification and periodic monitoring of suppliers. We will reveal the presence of high levels of TM contaminants that are present in varying amounts from batch to batch and supplier to supplier for the same precursor. Additionally, the same precursor from two different suppliers may contain totally different TM contaminants.
机译:所谓的前体分子的先进电子材料用于沉积预期可靠,自由污染和原始的薄膜。已经证明了金属污染的有害作用在硅上生长的热氧化物的介电性能下进行了证明[1]。为了实现超高纯度产品,基本上没有痕量金属(TM)和有机杂质,他们需要完全合格。前期,TM分析允许检测,识别和定量这些污染物,以帮助控制这些前体的质量,从而使其成为DRAM应用中的储物电容的原子层沉积的优选候选者,或MOS晶体管的栅极堆叠。在本文中,我们将展示前体中痕量金属浓度的固有变化,这需要进行评估,资格和定期监测供应商的量化。我们将揭示高水平的TM污染物,这些TM污染物在不同的量,从批量到批量和供应商提供给同一前体的供应商。另外,来自两个不同供应商的相同前体可含有完全不同的TM污染物。

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