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A batch study of trace metal impurities in high-k semiconductor precursors CFM: Contamination free manufacturing

机译:高k半导体前体CFM中痕量金属杂质的批量研究:无污染制造

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Advanced electronic materials called precursor molecules are designed for the deposition of thin films that are expected to be reliable, contamination free and pristine. Deleterious effects of metallic contamination have been demonstrated in dielectric properties of thermal oxides grown on silicon [1]. In order to achieve ultra-high purity products, essentially free from trace metals (TM) and organic impurities, they need to be fully qualified. Upfront, TM analysis allows detection, identification and quantification of these contaminants to help control the quality of these precursors thus making them the preferred candidates for atomic layer deposition of high-k materials as storage capacitors in DRAM applications, or gate stacks of MOS-transistors. In this paper, we will demonstrate the inherent variability of trace metal concentrations in precursors, that necessitates the quantification for evaluation, qualification and periodic monitoring of suppliers. We will reveal the presence of high levels of TM contaminants that are present in varying amounts from batch to batch and supplier to supplier for the same precursor. Additionally, the same precursor from two different suppliers may contain totally different TM contaminants.
机译:被称为前驱物分子的先进电子材料被设计用于沉积可靠,无污染且原始的薄膜。金属污染的有害影响已在硅上生长的热氧化物的介电性能中得到证明[1]。为了获得基本上不含痕量金属(TM)和有机杂质的超高纯度产品,它们需要完全合格。在前期,TM分析可以检测,识别和量化这些污染物,以帮助控制这些前驱物的质量,从而使它们成为高k材料原子层沉积的首选候选材料,这些材料可作为DRAM应用中的存储电容器或MOS晶体管的栅极叠层。在本文中,我们将证明前体中痕量金属浓度的内在变异性,这需要对供应商的评估,鉴定和定期监控进行量化。我们将揭示高浓度的TM污染物的存在,对于同一前体,批次之间,供应商之间,供应商之间存在不同数量的TM污染物。此外,来自两个不同供应商的同一前体可能包含完全不同的TM污染物。

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