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POTENTIAL OF PLASMA GROWN OXIDE FILMS FOR SURFACE PASSIVATION OF CRYSTALLINE SILICON SOLAR CELLS

机译:等离子体生长的氧化硅薄膜对硅太阳能电池表面钝化的潜力

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We report on the growth of thin silicon oxide films in an inductively coupled plasma chamber at a lowtemperature of 320°C. The films were grown in oxygen (O2), oxygen + argon (O2+Ar), oxygen + nitrogen (O2+N2),and nitrous oxide (N2O) ambients. The film composition is studied using fourier transform infrared spectroscopy(FTIR), and the presence of interstitial oxygen and Si-Si unsaturated bonds was confirmed for films grown in oxygenambient. Optical emission spectroscopy was used to study the atomic oxygen intensity within the plasma for variousambients used in the experiments, and its potential correlation to the amount of interstitial oxygen in silicon. Thefilms were capped with a silicon nitride layer (SiNx:H), and capacitance - voltage measurements were carried out.The minimum mid-gap interface state density was obtained for the stack comprising of the film grown in N2O plasmaambient. The surface recombination vel°City (SRV) was found to be the lowest for the stack based on oxide filmgrown in N2O ambient. The same stack showed lower SRV when compared to films grown in oxygen ambient, afterannealing at 400°C and after firing at 800°C.
机译:我们报告了在较低的电感耦合等离子体室中氧化硅薄膜的生长情况 温度为320°C。薄膜在氧气(O2),氧气+氩气(O2 + Ar),氧气+氮气(O2 + N2), 和一氧化二氮(N2O)环境。使用傅里叶变换红外光谱研究薄膜成分 (FTIR),并证实在氧气中生长的薄膜存在间隙氧和Si-Si不饱和键 周围的。使用光发射光谱法研究了各种情况下等离子体中的原子氧强度 实验中使用的环境温度及其与硅中间隙氧含量的电位相关性。这 用氮化硅层(SiNx:H)覆盖膜,并进行电容-电压测量。 对于包括在N2O等离子体中生长的薄膜的叠层,获得了最小的中间间隙界面态密度 周围的。发现基于氧化膜的叠层的表面复合速率(SRV)最低 在N2O环境中生长。与在氧气环境中生长的薄膜相比,相同的堆叠显示出较低的SRV 在400°C退火,然后在800°C焙烧。

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