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1/f noise in strained SiGe On Insulator MOSFETs

机译:绝缘体MOSFET上应变SiGe的1 / F噪音

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This paper presents low-frequency noise in Si_(0.75)Ge_(0.25) and Si_(0.65)Ge_(0.35) p- and n-channel strained Germanium on Insulator (SGOI) MOSFETs with 15nm thick substrates and with TiN/HfO_2/SiO_2 gate stacks, obtained using the enrichment technique. In strong inversion, front and back interface current noise in PMOSFET devices is described using the ΔN model, whereas NMOSFET noise is described using the ΔN-Δμ model, with a ten-fold increase in noise in some cases. In weak inversion, the noise behavior deviates from these standard models and may be described by noise coupling between the two interfaces. For both types of device, the extracted densities are approximately the same, with no significant impact from the variation of the Ge content.
机译:本文在绝缘体(SGoi)MOSFET上呈现SI_(0.75)GE_(0.25)和SI_(0.25)和SI_(0.65)GE_(0.35)P-和N沟道应变锗的低频噪声,具有15nm厚的基板和锡/ HFO_2 / SIO_2栅极堆叠,使用富集技术获得。在强大的反演中,使用Δn模型描述PMOSFET器件中的前后接口电流噪声,而使用Δn-Δμded,以Δn-Δμ模型描述了NMOSFET噪声,在某些情况下噪声增加了十倍。在弱反转中,噪声行为偏离这些标准模型,并且可以通过两个接口之间的噪声耦合来描述。对于两种类型的设备,提取的密度大致相同,从GE内容的变化没有显着影响。

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