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Improvement of 1/f noise in advanced 0.13 μm BiCMOS SiGe:C Heterojunction Bipolar Transistors

机译:先进的0.13μmBICMOSSiGe:C异质结双极晶体管的1 / F噪声提高

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In this study, we present recent low frequency noise results obtained on Si/SiGe:C Heterojunction Bipolar Transistors (HBTs) associated with a 0.13 μm BiCMOS technology. The HBTs are supplied by STMicroelectronics Crolles and present unity current gain frequencies (f_T) and maximum oscillation frequencies (f_(max)) in the 250s of GHz. The 1/f noise sources are found to be located in the intrinsic emitter-base (E-B) region. The 1/f noise figure of merit, K_B, is found to be close to 1.5 10~(-10) μm~2. This excellent result is at least one decade better than the initial development of this 0.13 μm BiCMOS technology. Moreover, in order to take into account the improvement of the high frequency parameters (f_T and f_(max)) associated to this technological evolution, we have studied the ratio f_c/f_T, figure of merit that links LF Noise and transistor speed. We have analyzed the 1/f noise improvement from different technological aspects related to the emitter-base process, for instance the surface cleaning (prior to the polysilicon deposition) and the epitaxial regrowth of the polysilicon.
机译:在这项研究中,我们在与0.13μmBICMOS技术相关联的Si / SiGe:C异质结双极晶体管(HBT)上获得了近期获得的低频噪声结果。 HBT由STMicroelectronics Crolles提供,并在GHz的250s中提供UNICS电流增益频率(F_T)和最大振荡频率(F_(MAX))。发现1 / f噪声源位于内在发射器碱(E-B)区域中。发现的1 / F噪声系数K_B,接近1.5 10〜(-10)μm〜2。这一优异的结果是至少一个十年,比该0.13μm的Bicmos技术的初始开发更好。此外,为了考虑与这种技术演变相关的高频参数(F_T和F_(最大))的改进,我们研究了链接LF噪声和晶体管速度的比率F_C / F_T,优点的比率。我们已经分析了与发射极碱处理相关的不同技术方面的1 / f噪声改善,例如表面清洁(在多晶硅沉积之前)和多晶硅的外延再生。

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