首页> 外文会议>International Conference on Electronic Packaging Technology >Influences of intermetallic compounds morphologies on fracture behaviors of Sn-3Ag-0.5Cu/Cu solder joint

【24h】

Influences of intermetallic compounds morphologies on fracture behaviors of Sn-3Ag-0.5Cu/Cu solder joint

机译：金属间化合物形态对SN-3AG-0.5Cu / Cu焊点断裂行为的影响

获取原文

页面导航

摘要
著录项
相似文献
相关主题

摘要

In this study, the influences of intermetallic compounds Cu6Sn5 at interface between solder and Cu substrate and Ag3Sn inside solder with different morphologies on the fracture behaviors of Sn-3Ag-0.5Cu/Cu solder joint were investigated. Cu6Sn5 grains became large in size with the increase of reflow time and aging procedure. Ag3Sn compounds appeared particle-like or branch-like morphologies as reflowed. However, some Ag3Sn compounds evolved into big rod-like shape after aging. The tensile results suggested that the strength of solder joint decreased with these evolvements of intermetallic compounds.

机译：在该研究中，研究了在SN-3AG-0.5CU / Cu / Cu / Cu焊接接头的断裂行为上对焊料和Cu衬底和具有不同形态的焊料与Cu衬底的裂缝和Ag3Sn的接口的影响。 CU6SN5谷物的大小随着回流时间和老化程序的增加而变大。 Ag3Sn化合物出现颗粒状或分支样形态，如回流。然而，老化后，一些Ag3Sn化合物在大杆状形状中进化成大棒状形状。拉伸结果表明，焊点强度随着金属间化合物的这些演变而降低。

著录项

来源
《International Conference on Electronic Packaging Technology 》|2013年||共3页
会议地点
作者
Yang L.M.; Zhang Z.F.;
展开▼
作者单位

展开▼
会议组织
原文格式 PDF
正文语种
中图分类封装及散热问题 ;
关键词
Coarsening; Intermetallic compounds; Lead-free solder; Tensile strength;

机译：粗化;金属间化合物;无铅焊料;拉伸强度;

相似文献

外文文献
中文文献
专利

1. Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment [J] . Tian Ruyu, Hang Chunjin, Tian Yanhong, Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2019 ,第期

机译：在极端温度环境下SN-3AG-0.5CU / Ni焊点中的Ni-Cu-SN金属间化合物的相变脆性脆性诱导
2. Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock [J] . Ruyu Tian, Chunjin Hang, Yanhong Tian, Materials Science and Engineering . 2018 ,第jana2期

机译：极端温度热冲击下金属间化合物的生长行为和Sn-3Ag-0.5Cu焊点中裂纹的早期形成
3. Interfacial intermetallic compound growth in Sn-3Ag-0.5Cu/Cu solder joints induced by stress gradient at cryogenic temperatures [J] . Tian Ruyu, Hang Chunjin, Tian Yanhong, Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2019 ,第期

机译：在低温温度下应力梯度诱导的SN-3AG-0.5CU / Cu / Cu焊点中的界面金属间化合物生长
4. Influences of intermetallic compounds morphologies on fracture behaviors of Sn-3Ag-0.5Cu/Cu solder joint [C] . Yang L.M., Zhang Z.F. International Conference on Electronic Packaging Technology . 2013

机译：金属间化合物的形态对Sn-3Ag-0.5Cu / Cu焊点断裂行为的影响
5. Orientation distribution, morphology, and size distribution of copper-tin intermetallic compound in reactions between molten solder and copper in flip chip solder joints. [D] . Suh, Jongook. 2006

机译：倒装芯片焊点中熔融焊料与铜之间的反应中铜锡金属间化合物的方向分布，形态和尺寸分布。
6. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions [O] . Ai Ting Tan, Ai Wen Tan, Farazila Yusof 2015

机译：纳米粒子添加对不同热条件下Cu / Sn-Ag-Cu / Cu焊点中金属间化合物（IMCs）的形成和生长的影响
7. Influence of ZnO particles addition on interface morphology evolution of Sn-3Ag-0.5Cu solder joints [O] . Min Qu, Tianze Cao, Yan Cui, 2018

机译：ZnO颗粒添加对SN-3AG-0.5CU焊点的界面形态演化的影响

Influences of intermetallic compounds morphologies on fracture behaviors of Sn-3Ag-0.5Cu/Cu solder joint

摘要

著录项

相似文献

相关主题

期刊订阅