Influences of intermetallic compounds morphologies on fracture behaviors of Sn-3Ag-0.5Cu/Cu solder joint

机译：金属间化合物的形态对Sn-3Ag-0.5Cu / Cu焊点断裂行为的影响

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In this study, the influences of intermetallic compounds Cu6Sn5 at interface between solder and Cu substrate and Ag3Sn inside solder with different morphologies on the fracture behaviors of Sn-3Ag-0.5Cu/Cu solder joint were investigated. Cu6Sn5 grains became large in size with the increase of reflow time and aging procedure. Ag3Sn compounds appeared particle-like or branch-like morphologies as reflowed. However, some Ag3Sn compounds evolved into big rod-like shape after aging. The tensile results suggested that the strength of solder joint decreased with these evolvements of intermetallic compounds.

机译：在这项研究中，研究了金属间化合物Cu6Sn5在焊料和Cu衬底之间的界面以及不同形态的焊料内部的Ag3Sn对Sn-3Ag-0.5Cu / Cu焊料接头的断裂行为的影响。随着回流时间和时效过程的增加，Cu6Sn5晶粒尺寸变大。回流时，Ag3Sn化合物呈颗粒状或分支状形态。但是，一些Ag3Sn化合物在老化后会演变成大棒状。拉伸结果表明，随着金属间化合物的这些演变，焊点的强度降低。

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《International Conference on Electronic Packaging Technology》|2013年|247-249|共3页
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Yang L.M.; Zhang Z.F.;
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Coarsening; Intermetallic compounds; Lead-free solder; Tensile strength;

机译：粗化;金属间化合物;无铅焊料;拉伸强度;

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专利

1. Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment [J] . Tian Ruyu, Hang Chunjin, Tian Yanhong, Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2019,第期

机译：在极端温度环境下SN-3AG-0.5CU / Ni焊点中的Ni-Cu-SN金属间化合物的相变脆性脆性诱导
2. Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock [J] . Ruyu Tian, Chunjin Hang, Yanhong Tian, Materials Science and Engineering . 2018,第jana2期

机译：极端温度热冲击下金属间化合物的生长行为和Sn-3Ag-0.5Cu焊点中裂纹的早期形成
3. Interfacial intermetallic compound growth in Sn-3Ag-0.5Cu/Cu solder joints induced by stress gradient at cryogenic temperatures [J] . Tian Ruyu, Hang Chunjin, Tian Yanhong, Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2019,第期

机译：在低温温度下应力梯度诱导的SN-3AG-0.5CU / Cu / Cu焊点中的界面金属间化合物生长
4. Influences of intermetallic compounds morphologies on fracture behaviors of Sn-3Ag-0.5Cu/Cu solder joint [C] . Yang L.M., Zhang Z.F. International Conference on Electronic Packaging Technology . 2013

机译：金属间化合物形态对SN-3AG-0.5Cu / Cu焊点断裂行为的影响
5. Orientation distribution, morphology, and size distribution of copper-tin intermetallic compound in reactions between molten solder and copper in flip chip solder joints. [D] . Suh, Jongook. 2006

机译：倒装芯片焊点中熔融焊料与铜之间的反应中铜锡金属间化合物的方向分布，形态和尺寸分布。
6. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions [O] . Ai Ting Tan, Ai Wen Tan, Farazila Yusof 2015

机译：纳米粒子添加对不同热条件下Cu / Sn-Ag-Cu / Cu焊点中金属间化合物（IMCs）的形成和生长的影响
7. Influence of ZnO particles addition on interface morphology evolution of Sn-3Ag-0.5Cu solder joints [O] . Min Qu, Tianze Cao, Yan Cui, 2018

机译：ZnO颗粒添加对SN-3AG-0.5CU焊点的界面形态演化的影响

Influences of intermetallic compounds morphologies on fracture behaviors of Sn-3Ag-0.5Cu/Cu solder joint

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