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The Degradation of High Power Gallium Nitride Light-emitting Diodes

机译:高功率氮化镓发光二极管的降解

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In this paper, the degradation of bare high power GaN/InGaN blue light-emitting diodes (HP-LEDs) was investigated by considering the electrical, thermal and optical aging characteristics. The HP-LED samples were stressed at the elevated temperature of 85 °C with an injection current of 500 mA. The rated current of the HP-LEDs is 350 mA at room temperature. Changing in tunneling current for the electrical characteristic, a gradual increase for the external quantum efficiency (EQE), a gradual decrease for the light power and the luminous flux were monitored. The luminous intensity distribution is more uneven after degradation. And thermal resistance and temperature rise of chip increase with aging time. In addition, the thermal resistance of the die-attach and ceramic wafer were also increasing after aging. After theoretical calculation, the defect concentration of the die monotonously increases with aging time. Therefore, the responsible factors of these changes were proposed to be the generation of the dopant activation, point defects, dislocations and other defects in the chip level during highly accelerated test. These defects as non-radiative recombination centers make charge carrier cross quantum well structure directly. Thereby, the degradation of the electrical, thermal and optical aging characteristics of HP-LEDs is observed.
机译:在本文中,通过考虑电气,热和光学老化特性,研究了裸高功率GaN / InGaN蓝色发光二极管(HP-LED)的劣化。将HP-LED样品在85℃的升高温度下施压,注射电流为500 mA。 HP-LED的额定电流在室温下为350 mA。监测外部量子效率(EQE)的跨电电流改变,监测外部量子效率(EQE)的逐渐增加,对光功率和光通量的逐渐减小。发光强度分布在降解后更不均匀。随着老化时间,芯片的热阻和温度升高。此外,老化后,模具连接和陶瓷晶片的热阻也在增加。在理论计算之后,模具的缺陷浓度单调随着老化时间而增加。因此,建议在高度加速试验期间,提出了这些变化的负责因素是掺杂剂活化,点缺陷,位错和芯片水平中的其他缺陷。这些缺陷作为非辐射重组中心直接使电荷载体交叉量子阱结构。由此,观察到HP-LED的电,热和光学老化特性的劣化。

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