Improvement of the thermal conductivity by surface iodination

摘要

With the increasing demand of high power density electronics, heat dissipation becomes an urgent problem. In order to address this problem, we introduce a surface modification method for silver that are employed as fillers to prepare the thermal conductive adhesive (TCA). After simple iodine pretreatment, there exist some nano-sized small structures on the surface of fillers. Compared to the control sample, the TCA with modified fillers exhibits a superior thermal conductivity. The conductivity increases accordingly to the increase of curing temperature. This facile filler modification method may efficiently improve the performance of the TCAs and find broader applications in high density packages.