Millimeter Wave Antenna in Package (AiP) Using Unbalanced Substrate with and without Solder Mask.

摘要

In order to verify the influence of the solder mask of the stacked antenna surface for antenna performance, this work propose the 1×4 patch array for fifth-generation mobile communications (5G) application. The proposed antenna array is built on un-balanced substrate with 4 metal layers for landside did type package. The whole package size is 30×16×1.027 mm^{3. Two materials were fabricated on the surface of the antenna as solder mask and electroless nickel-plated electroless palladium gold (ENEPIG), and the bandwidth and gain were measured. The measurement results show a bandwidth difference of 1.2 % with -10 dB return loss and gain difference of 0.6% at 28GHz. This paper shows that the solder mask of the antenna surface has no significant effect on the antenna performance at 28 GHz.}