首页> 外国专利> RESIN COMPOSITION FOR MILLIMETER-WAVE SUBSTRATE, ADHESIVE FILM FOR MILLIMETER-WAVE SUBSTRATE, MILLIMETER-WAVE SUBSTRATE, MILLIMETER-WAVE RADAR SUBSTRATE, AND SEMICONDUCTOR DEVICE

RESIN COMPOSITION FOR MILLIMETER-WAVE SUBSTRATE, ADHESIVE FILM FOR MILLIMETER-WAVE SUBSTRATE, MILLIMETER-WAVE SUBSTRATE, MILLIMETER-WAVE RADAR SUBSTRATE, AND SEMICONDUCTOR DEVICE

机译:毫米波基质的树脂组成,毫米波基质的胶粘膜,毫米波基质,毫米波雷达基质和半导体器件

摘要

The present invention provides a resin composition that is for a millimeter-wave substrate, that provides a cured product having excellent high-frequency characteristics, a small temperature dependence of tanδ, and superior flame retardance, and that can be used as an insulator for a millimeter-wave radar. The resin composition for a millimeter-wave substrate contains a hydrogenated styrene-based elastomer (A), a cross-linkable compound (B) having a biphenyl backbone, and a flame retardant (C) containing a metal salt of phosphinic acid, and is characterized in that: component (C) accounts for 15-50 parts by mass with respect to a total of 100 parts by mass of component (A), component (B), and component (C); and the rate of change of dielectric tangent of a cured product of said resin composition at 10 GHz at 120°C is at most 30% with respect to that at 25°C.
机译:本发明提供了一种用于毫米波基板的树脂组合物,其提供了具有优异的高频特性,tanδ的温度依赖性小以及优异的阻燃性的固化产物,并且可以用作绝缘体。毫米波雷达。毫米波基板用树脂组合物包含氢化苯乙烯类弹性体(A),具有联苯骨架的可交联化合物(B)和包含次膦酸金属盐的阻燃剂(C),并且其特征在于:(C)成分相对于(A)成分,(B)成分和(C)成分的合计100质量份为15〜50质量份。所述树脂组合物的固化物在120℃下在10GHz下的介电正切变化率相对于25℃下为30%以下。

著录项

  • 公开/公告号WO2020116408A1

    专利类型

  • 公开/公告日2020-06-11

    原文格式PDF

  • 申请/专利权人 NAMICS CORPORATION;

    申请/专利号WO2019JP47101

  • 申请日2019-12-02

  • 分类号C09J11/06;H01L23/12;C08K5/5313;C08L53;C09J109/06;C09J153/02;C09J163;C09J7/20;C09J7/35;H05K1/03;

  • 国家 WO

  • 入库时间 2022-08-21 11:10:48

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号