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Formation of Ge-on-Insulator Structures on Si Platform by SiGe-Mixing-Triggered Rapid-Melting Growth using RTA Technique

机译:使用RTA技术通过SiGe混合触发的快速熔化生长在Si平台上形成Ge-Insulator结构

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Single-crystal Ge layers on insulating films (GOI) are desired to achieve advanced 3-dimensional large-scale integrated circuits and high-performance thin-film transistors. Rapid-melting Ge growth seeded from Si substrates, which utilizes rapid thermal annealing (RTA) technique with narrow Ge stripes on insulator, achieves chip-scale (~cm length) GOI structures with (100), (110), and (111) orientations. Profile of Si in Ge stripe is robustly controlled by sample structures (stripe length) and process conditions (cooling rate).
机译:期望在绝缘膜(GOI)上的单晶GE层来实现先进的三维大规模集成电路和高性能薄膜晶体管。从SI基板上接种的快速熔化GE生长,其利用具有窄GE条纹的快速热退火(RTA)技术在绝缘体上实现芯片级(~cm长度)GOI结构,具有(100),(110)和(111)方向。通过样品结构(条纹长度)和工艺条件(冷却速率)强大地控制GE条带中的SI轮廓。

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