Analysis of Solder Fatigue on Mounted Test Assemblies under Thermal Cycling Loads

机译：热循环载荷下安装试验组件上的焊料疲劳分析

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Reliability is an obvious requirement in particular for the developing use of automotive electronics towards autonomous driving. Micro-electronics must also stay reliable in mounting situations, denoted as “3

机译：可靠性是一种明显的要求，特别是用于开发汽车电子设备走向自动驾驶的明显要求。微电子也必须保持可靠的安装情况，表示为“3” ^展开▼

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《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》|2020年|395p|共8页
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R. Dudek; M. Hildebrandt; K. Krey?ig; S. Rzepka; R. D?ring; L. Scheiter; M. Zhang; R. W. Ortmann;
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中图分类自动模拟理论（自动仿真理论）;
关键词
Temperature measurement; Strain; Transient analysis; Loading; Stress; Fasteners; Load modeling;

机译：温度测量;应变;瞬态分析;装载;应力;紧固件;负载建模;

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专利

1. Modeling thermally induced viscoplastic deformation and low cycle fatigue of CBGA solder joints in a surface mount package [J] . Bor Zen Hong, Burrell L.G. IEEE transactions on components, packaging, and manufacturing technology. Part A . 1997,第3期

机译：模拟表面贴装封装中CBGA焊点的热致粘塑性变形和低周疲劳
2. Solder Joint Fatigue in a Surface Mount Assembly Subjected to Mechanical Loading [J] . Tamin M.N., Yek Ban Liew, Wagiman A.N.R., IEEE Transactions on Components and Packaging Technologies . 2007,第4期

机译：承受机械载荷的表面安装组件中的焊点疲劳
3. Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components [J] . Vandevelde Bart, Vanhee Filip, Pissoort Davy, Microelectronics & Reliability . 2017,第jula期

机译：四点弯曲循环：电子元件热循环焊接疲劳测试的替代方法
4. Analysis of Solder Fatigue on Mounted Test Assemblies under Thermal Cycling Loads [C] . R. Dudek, M. Hildebrandt, K. Kreyßig, International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems . 2020

机译：热循环载荷下安装的测试组件上的焊料疲劳分析
5. Thermomechanical behavior of ball grid array solder joints under thermal and vibration loading: Testing and modeling. [D] . Zhao, Ying. 2001

机译：球栅阵列焊点在热和振动载荷下的热力学行为：测试和建模。
6. Correlation between Thermal Behaviour of AA5754-H111 during Fatigue Loading and Fatigue Strength at Fixed Number of Cycles [O] . Rosa De Finis, Davide Palumbo, Livia Maria Serio, 2018

机译：固定循环次数下疲劳加载过程中AA5754-H111的热行为与疲劳强度的相关性
7. A System-Level Framework For Fatigue Life Prediction of PWR Pressurizer-Surge-Line Nozzle under Design-Basis Loading Cycles. A complete tensile test based material properties database and preliminary results on 3D weld process modeling, thermal-mechanical stress analysis and environmental fatigue testing [O] . Subhasish Mohanty, Jae Phil Park, Joseph T. Listwan 2019

机译：设计基础装载循环下PWR压力机电涌管线喷嘴疲劳寿命预测的系统级框架。基于拉伸测试的材料特性数据库和3D焊接过程建模，热机械应力分析和环境疲劳试验的初步结果
8. Thermal Cycling Fatigue in DIPs Mounted with Eutectic Tin-Lead Solder Joints in Stub and Gullwing Geometries [R] . Winslow, J. W., Silveira, C. de 1993

机译：DIps中的热循环疲劳，在stub和Gullwing几何中安装有共晶锡铅焊点

Analysis of Solder Fatigue on Mounted Test Assemblies under Thermal Cycling Loads

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