Chip Package Interaction (CPI) Stress Modeling

机译：芯片包交互（CPI）应力建模

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In order to address the Chip-Package Interaction (CPI) risks associated with advanced silicon packaging, GLOBALFOUNDRIES has developed Finite Element (FE) models to simulate the mechanical stress in the Backend of Line (BEoL) and Far Back End of Line (FBE

机译：为了解决与先进的硅包装相关的芯片包交互（CPI）风险，GlobalFoundries开发了有限元（FE）模型，以模拟线路（BEOL）后端和远端线的机械应力（FBE

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《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》|2020年|395p|共4页
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Kashi Vishwanath Machani; Frank Kuechenmeister; Dirk Breuer; Jens Paul;
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中图分类自动模拟理论（自动仿真理论）;
关键词
Semiconductor device modeling; Load modeling; Data models; Copper; Finite element analysis; Silicon; Substrates;

机译：半导体器件建模;负载建模;数据模型;铜;有限元分析;硅;基板;

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专利

1. Chip Packaging Interaction (CPI) with Cu Pillar Flip Chip for 20 nm Silicon Technology and Beyond [J] . Gao Shan, Smith Ryan Scott, Cho Jae Kyu, ECS Journal of Solid State Science and Technology . 2015,第1期

机译：与用于20 nm硅技术的Cu柱状倒装芯片的芯片封装相互作用（CPI）
2. Cu Pillar Bump Development for 7-nm Chip Package Interaction (CPI) Technology [J] . Lei Fu, Milind Bhagavat, Cheryl Selvanayagam, Journal of Microelectronics and Electronic Packaging . 2020,第1期

机译：铜柱凹凸开发7纳米芯片封装相互作用（CPI）技术
3. Cu Pillar Bump Development for 7nm Chip Package Interaction (CPI) Technology [J] . Lei Fu, Milind Bhagavat, Cheryl Selvanayagam, Advancing Microelectronics . 2019,第6期

机译：用于7nm芯片封装交互（CPI）技术的铜柱凸点开发
4. Chip Package Interaction (CPI) Stress Modeling [C] . Kashi Vishwanath Machani, Frank Kuechenmeister, Dirk Breuer, International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems . 2020

机译：芯片封装交互（CPI）应力模型
5. Chip package interaction (CPI) and its impact on the reliability of flip-chip packages. [D] . Zhang, Xuefeng. 2009

机译：芯片封装相互作用（CPI）及其对倒装芯片封装可靠性的影响。
6. MultiChIPmixHMM: an R package for ChIP-chip data analysis modeling spatial dependencies and multiple replicates [O] . Caroline Bérard, Michael Seifert, Tristan Mary-Huard, 2013

机译：MultiChIPmixHMM：用于ChIP芯片数据分析的R软件包用于建模空间依赖性和多次重复
7. Rcpi: R/Bioconductor package to generate various descriptors of proteins, compounds and their interactions [O] . D.-S. Cao, N. Xiao, Q.-S. Xu, 2014

机译：RCPI：R / Biocuconductor封装，用于产生蛋白质，化合物及其相互作用的各种描述符
8. IC chip stress during plastic package molding [R] . Palmer, D. W. , Benson, D. A. , Peterson, D. W. , 1998

机译：塑料封装成型时的IC芯片应力

Chip Package Interaction (CPI) Stress Modeling

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