Mechanical analysis of encapsulated metal interconnects under transversal load

摘要

Novel insights regarding the ability of encapsulated metal interconnections to deform due to bending are presented. Encapsulated metal interconnections are used as electric conductor or measurement system within a wide range of applications fields, e.g. biomedical, wearable, textile applications. Nevertheless the mechanical analysis remains limited to reliability investigation of these configurations while deformability is as important for application fields where, so-called disappearing electronics is the main purpose.