Characterization and modeling of the AuCuSn thin solder joint under thermal cycling

摘要

Thin Au2Cu6Sn2 solder joints have been identified to provide improved electrical and thermal device performance compared to thicker solder joints [1]. Both the material high thermal conductivity and the reduced joint thickness improve the thermal dissipation through the solder joint, making the thin Au2Cu6Sn2 solder layer very attractive for high power devices. In this paper, we establish a material model for the Au2Cu6Sn2 material in order to study solder thermal fatigue using finite element analysis.