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New challenges emerging on the design of VLSI circuits made of MOSFETs using new gate dielectric materials

机译:采用新栅极电介质材料开辟了MOSFET制成的VLSI电路设计的新挑战

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While Quality Electronic Design issues regarding typical MOSFETs constructed by well established techniques and made of SiO/sub 2/ gate dielectrics are yet to optimised, new issues regarding the implementation of MOSFETs having gates made of high-k dielectric materials other than SiO/sub 2/ are being raised during the last years. Parameters such as the high dielectric constant values, extra oxide charges and process related defects have to be taken into account. In this paper, such issues are addressed. The case replacing commonly used parameters of the MOSFET modelling with new ones that will take into account the presence of a material with different properties than that of SiO/sub 2/ is presented and proposals are made. Moreover, a case study is presented, where a memory device is examined. An overall estimation of the proposed procedure is attempted and further work is proposed.
机译:虽然由已建立的技术构成的典型MOSFET和由SIO / SUB 2 /栅极电介质制成的典型MOSFET的质量电子设计问题尚未得到优化,但是关于具有由SIO / SUB 2以外的高k介电材料制成的栅极的MOSFET的实施的新问题/在过去几年中提出。必须考虑诸如高介电常数,额外氧化物电荷和工艺相关缺陷的参数。在本文中,这些问题是解决的。替换使用新的MOSFET建模的常用参数,该参数将考虑到具有不同特性的材料的存在而不是提出了不同的属性,并且提出了提案。此外,提出了一种案例研究,其中检查存储器设备。拟议的程序的总体估计是拟议的,提出进一步的工作。

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