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Temperature and devices dimension dependence on threshold voltage, the low field mobilty and the series parasitic resistance of PMOSFET

机译:温度和器件尺寸取决于阈值电压,低场迁移率和MOSFET的串联寄生电阻

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This paper presents the temperature and devices dimension dependence on the threshold voltage, low field mobility and series parasitic resistance of PMOS over operating temperature range of 27 °C to 125 °C. The relation of IDS and VGS in linear region was used with a different of channel length and channel width. The parameters extraction procedure is based on the measurement of the transconductance characteristics of MOSFET in linear region. The results show that, the temperature coefficient for threshold voltage is around 1.7mV/K approximately. The low field mobility degradation parameter is decreased by the factor of 0.68. The temperature coefficient of source-drain series resistance per unit channel width (RDSW) is approximately 16.7 ohm-um/K. These data are necessary not only should be compared with the results of NMOS but also should be used for the circuit designer to understanding well in the elevated operating temperatures.
机译:本文介绍了温度和器件尺寸取决于PMOS在27°C至125°C工作温度范围内的阈值电压,低场迁移率和串联寄生电阻。线性区域中的I DS 和V GS 之间的关系用于不同的通道长度和通道宽度。参数提取过程基于线性区域中MOSFET跨导特性的测量。结果表明,阈值电压的温度系数约为1.7mV / K。低场迁移率降低参数降低了0.68倍。每单位沟道宽度的源极-漏极串联电阻的温度系数(R DSW )约为16.7 ohm-um / K。这些数据是必要的,不仅应与NMOS的结果进行比较,而且还应被电路设计人员用来更好地理解在升高的工作温度下的数据。

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