Thermomechanical analysis and reliability performance of a semiconductor package using a single gauge leadframe design

摘要

The use of copper-based dual gauge leadframe design is proven effective in the thermal, electrical, and reliability of power devices housed in a Surface Mount Devices (SMD) packages. DPAK and D2PAK packages take preference on the use of this dual gauge leadframe design, a thick leadframe diepad or heatsink thickness up to twice as thick as their leads thickness. Reducing the copper heatsink thickness to form a single gauge leadframe, a thinner version of the dual gauge leadframe, was perceived to present various electrical, thermal and reliability failure mode and mechanisms, specifically die cracking.