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Improved Ball-on-Elastic-Pad and Ball-on-Hole Tests for Silicon Die Strength

机译:改进的弹性垫和硅模具强度的球形孔测试

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For determining die strength, there are a couple of tests available in the literature, such as three-point and four-point bending, ball breaker, ball-on-the-ring, ring-on-the-ring, and recently proposed ball-on-elastic-pad (BoEP) and ball-on-the-hole (BoH) tests. It's well known that the test data reduction with theoretical formulations is more convenient and useful than that with numerical simulation results. However, those theoretical formulations have to be validated either by numerical simulation or experiments, before their applications. The objective of this study is to reevaluate and thus improve the existing BoEP and BoH tests for die strength using Hertzian contact theory, plate theories and finite element method (FEM). In this paper, the FEM analysis with "contact element" successfully has been verified with Hertzian contact theory and further proved that Hertzian contact theory can be employed to estimate the contact area for calculating die strength in both methods. The results indicate that the consistency between the theoretical formulation and FEM simulation for both tests exist only at the relatively large radius of ball and high applied loading, because the feasibility of the theoretical formulations requires large contact radius (>0.06 mm) or area. For the BoEP test, the elastic moduli of elastic pad and ball have no obvious effect on the difference of maximum die stress between theoretical and FEM results, The theoretical solutions associated with contact radius determined by Hertzian contact theory are successfully proved for improving BoEP and BoH tests for die strength determination, and for better accuracy of die strength the ball with radius ranging from 2 mm to 4 mm is suggested.
机译:为了确定模具强度,文献中有几种测试,例如三点和四点弯曲,球破碎机,环形环,环形环,最近提出的球 - 弹性垫(BoEP)和孔孔(BoH)测试。众所周知,具有理论制剂的测试数据降低比具有数值模拟结果的更方便和有用。然而,这些理论制剂必须通过在其应用之前通过数值模拟或实验进行验证。本研究的目的是使用赫兹联络理论,板材理论和有限元方法(FEM)来重新评估,从而改善模具强度的现有BoEP和BOH测试。在本文中,用赫斯氏接触理论验证了“接触元件”的有限元分析,并进一步证明了赫斯琴接触理论可以用于估计两种方法中的模具强度的接触区域。结果表明,两个测试的理论制剂和有限元模拟之间的一致性仅存在于相对较大的球半径和高施加的负载,因为理论制剂的可行性需要大的接触半径(> 0.06mm)或面积。对于BoEP测试,弹性垫和球的弹性模量对理论和有限元素结果之间的最大芯片应力的差异没有明显影响,成功地证明了与赫斯联系理论确定的接触半径相关的理论溶液,以改善BOEP和BOH模具强度测定的测试,并且为了提高模具强度的精度,提出了线径范围为2mm至4mm的球。

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