With the development of ultralarge-scale integrated circuits, the feature sizes of integrated circuits have decreased to about 180 nm or even smaller. Consequently, reduction in the electrical resistance induced by interaction between interconnect lines, time delay caused by wire capacitance, crosstalk and power dissipation have become bottleneck problems limiting the progress of high-speed, low power cost and multi-functional integrated circuits. For this reason, finding good candidate materials with the low dielectric constant and low dissipation factor is significant issue for development of high frequency IC substrate materials. There are some common methods to obtain polymer materials with low dielectric constant and dissipation factor. First, the atoms involved in preparing dielectric polymers can be chosen such as to decrease the molecular polarizability. The choice of precursor with atoms that have appropriate electronegativity and bonding them in an appropriate configuration can reduce the molecular polarizability to low values; for example, incorporation of fluorine atoms in Polymer backbone forming C-F is good ways to approach lower the dielectric constant of polymers. In addition, incorporation of more C-C building blocks with low polarizability in the polymer backbone can also decrease the dielectric constant. Accordingly, another method that can be used to lower the dielectric constant is that to lower the density of polymer films. Another method to obtain good to dielectric polymer incorporating low Dk/Df polymer with conventional epoxy resin such as styrene maleic anhydride (SMA) and PPE to decrease the Dk/Df of original polymer. With increasing environmental consciousness, it is already the irresistible tendency for the printed circuit board materials have been changed design development focus form traditional halogen materials to environmentally friendly halogens-free materials. Therefore, the second method to approach the low Dk/Df polymer is mor- beneficial for environment than first methods. In this study, the status and the new development of low dielectric constant and dissipation factor, halogen-free and phosphorous-free copper clad laminate material will be introduced. This material possesses outstanding characteristics including high Tg, good dielectric properties, excellent thermal properties, good flammability, and so on.
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