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首页> 外文期刊>Journal of Materials Chemistry, C. materials for optical and electronic devices >Intrinsic low dielectric behaviour of a highly thermally stable Sr-based metal-organic framework for interlayer dielectric materials
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Intrinsic low dielectric behaviour of a highly thermally stable Sr-based metal-organic framework for interlayer dielectric materials

机译:层间介电材料的高度热稳定的Sr基金属有机骨架的固有低介电行为

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摘要

A Sr-based metal-organic framework {[Sr2(1,3-bdc)2(H2O)2] · H2O}_n (1) was synthesized under hydrothermal conditions by the reaction of Sr(NO3)2 and l,3-bis(4,5-dihydro-2-oxazolyl)benzene. A single-crystal X-ray diffraction analysis revealed that compound 1 adopts a 2D layer structure with a monoclinic (C2/c) space group. The distance between the layers of the structure adjusts upon the removal of the water molecules from 95 °C to 330 °C. In addition, the dehydrated compound 1' retains its crystalline morphology and shows a high thermal stability at temperatures of up to 420 °C. Significantly, the dehydrated compound 1' has a very low dielectric constant (2.4), suggesting that it might be useful as an interlayer dielectric in integrated circuits. As indicated by impedance spectroscopy, such low dielectric constant behavior is due to the intrinsic nature of the bulk material. The preparation of a low dielectric constant Sr-based metal-organic framework with a high thermal stability opens new directions for research into its applications.
机译:通过水热条件下,通过Sr(NO3)2与l,3-的反应合成了基于Sr的金属有机骨架{[Sr2(1,3-bdc)2(H2O)2]·H2O} _n(1)。双(4,5-二氢-2-恶唑基)苯。单晶X射线衍射分析表明,化合物1采用具有单斜(C2 / c)空间基团的2D层结构。结构层之间的距离可根据水分子从95°C到330°C的去除情况进行调整。另外,脱水的化合物1'保持其晶体形态,并且在高达420℃的温度下显示出高的热稳定性。显着地,脱水化合物1'具有非常低的介电常数(2.4),这表明它可用作集成电路中的层间电介质。如阻抗谱所表明的,如此低的介电常数行为归因于块状材料的固有性质。具有高热稳定性的低介电常数Sr基金属有机骨架的制备为其应用研究开辟了新方向。

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