Thermally aware modeling and performance for MWCNT bundle as VLSI interconnects for high performance integrated circuits

摘要

In the recent times MWCNT bundle interconnects at global interconnect level, has been considered as an alternative to the conventional copper interconnects. In this paper, the influence of temperature on mean free path (MFP) of MWCNT bundle as interconnects is presented. The temperature dependent MFP is used to evaluate the impedance parameters of MWCNT bundle for nanoscaled technology nodes. Further, a similar analysis is performed for copper interconnects to compare the results with MWCNT bundle. Results show that MWCNT interconnects offered lesser resistances compared to copper interconnects for temperature ranging from 200K-450K at 32nm, 22nm and 16nm technology nodes.