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Characterization of a wire bonding process with the added challenges from palladium-coated copper wires

机译:引线键合工艺的表征,以及镀钯铜线带来的更多挑战

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In this study, we experimented with palladium-coated copper (PdCu) wires of different diameters (0.6 mil, 0.7 mil and 0.8 mil) and from different manufactures. It was seen that wire diameters that varied within the manufacturing tolerances show an effect on bonding responses. The effect was especially prominent in the production environment, for example, when electric-flame-off (EFO) time remained fixed and free air ball (FAB) and subsequent bonded ball size varied according to the variation in wire diameter. The effect of Pd thickness control in PdCu wire was also studied and its implication to bonding responses is presented. Aside from the variations from the wires, bonding parameters such as EFO conditions, cover gas types, and gas flow rates were also found to affect wire bonding responses by varying degrees for wires from different suppliers. All of these observations suggest the added complications and considerations necessary when dealing with PdCu wire. Therefore, ensuring an understanding of the wire characteristics, especially pertaining to the Pd coating and their relations to wire bonding responses, is critical in overcoming these additional challenges.
机译:在这项研究中,我们对不同直径(0.6密耳,0.7密耳和0.8密耳)的钯涂层铜(PdCu)线进行了实验,并使用了不同的制造商。可以看出,在制造公差范围内变化的导线直径显示出对键合响应的影响。这种效果在生产环境中尤为突出,例如,当电熄火(EFO)时间保持固定并且自由空气球(FAB)和随后的粘结球尺寸根据导线直径的变化而变化时。还研究了PdCu线中Pd厚度控制的影响,并提出了其对键合响应的影响。除了导线的变化以外,还发现诸如EFO条件,覆盖气体类型和气体流速之类的焊接参数也会通过不同程度的来自不同供应商的导线来影响导线的焊接响应。所有这些观察结果表明在处理PdCu线材时会增加复杂性和必要的考虑因素。因此,确保克服导线特性,特别是与Pd涂层有关的特性及其与导线键合响应的关系,对于克服这些额外挑战至关重要。

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