Higher performance, higher operation speed and volume shrinkage require high 3D TSV interconnect densities. This work focuses on a via-middle 3D process flow, which implies processing of the 3D-TSV after the front-end-of-line (FEOL) and before the back-end-of-line (BEOL) interconnect process. A description of the imec 300 mm TSV platform is given, and challenges towards a reliable process integration of high density high aspect-ratio 3D interconnections are also discussed in details.
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机译：更高的性能，更高的运行速度和体积缩小要求更高的3D TSV互连密度。这项工作集中于中间3D处理流程，这意味着在前端（FEOL）之后和后端（BEOL）互连过程之前对3D-TSV进行处理。给出了imec 300 mm TSV平台的描述，并且还详细讨论了对高密度高长宽比3D互连的可靠过程集成的挑战。
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