Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer

摘要

Electrical and mechanical performance of Quilt Packaging (QP), a 2D system-in-package chip-to-chipinterconnection, is presented. QP employs contacts at the edges of integrated circuit dies along their verticalsurfaces. Based on 3D HFSS simulations, the self-inductance of QP can be less than 0.01 nH, and the selfcapacitancecan be less than 0.034 pF due to the shortness of the interconnection path. QP interconnection usingsolder paste with pin transfer is presented, and mechanical reliability is evaluated. A new pull test systemspecifically designed for QP is presented. The pull force that causes failure in a set of edge interconnects totaling 3mm width of nodules is about 658 gram-force for Sn63Pb37 and 953 gram-force for SAC305.