Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer

摘要

Electrical and mechanical performance of Quilt Packaging (QP), a 2D system-in-package chip-to-chip interconnection, is presented. QP employs contacts at the edges of integrated circuit dies along their vertical surfaces. Based on 3D HFSS simulations, the self-inductance of QP can be less than 0.01 nH, and the selfcapacitance can be less than 0.034 pF due to the shortness of the interconnection path. QP interconnection using solder paste with pin transfer is presented, and mechanical reliability is evaluated. A new pull test system specifically designed for QP is presented. The pull force that causes failure in a set of edge interconnects totaling 3 mm width of nodules is about 658 gram-force for Sn63Pb37 and 953 gram-force for SAC305.