THE EVOLUTION OF SLURRY GRIT PROPERTIES DURING MULTI WIRE WAFERING OF SILICON BRICKS

摘要

Using an industrial scale multi wire saw set up, the evolution of the slurry grit in the wafering processhas been investigated. Two series of cuts have been performed with different slurry grits, each slurry batch beingused for several consecutive cuts during which slurry samples have been extracted. The saw has been modified toallow for the in situ sampling of the slurry immediately in front of, and at the rear of, the brick that is being wafered.The slurry samples have been analysed for shape and size parameters, allowing conclusions to be drawn about theeffect on the grit of a single pass through the sawing channel, as well as the overall evolution through the cuts.