Using an industrial scale multi wire saw set up, the evolution of the slurry grit in the wafering process has been investigated. Two series of cuts have been performed with different slurry grits, each slurry batch being used for several consecutive cuts during which slurry samples have been extracted. The saw has been modified to allow for the in situ sampling of the slurry immediately in front of, and at the rear of, the brick that is being wafered. The slurry samples have been analysed for shape and size parameters, allowing conclusions to be drawn about the effect on the grit of a single pass through the sawing channel, as well as the overall evolution through the cuts.
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