Study of 3-D staking assembly based on the package material of PCB

摘要

This paper proposes a PCB-based packaging material stacking method which uses three-dimensional assembly technologies based on the studies of stacking assembly method. By the split structure design, welding process location and reflow temperature control, this method implements a 3-D stacking structure based on PCB package materials. It solves stacking assembly, welding and interconnects problems of multiple chips, and offers a new approach to the stacked 3-D assembly technology for its small volume, high reliability and low cost.