Interfacial reaction of heat-sink during vacuum and reflow soldering in space power electronics

机译：空间动力电子吸水过程中散热器的界面反应

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The heat-sink interfacial reaction of Sn-90Pb, Sn-95Pb, Sn-37Pb solders are contrast with the Sn-3.0Ag-0.5Cu solder in vacuum soldering and reflow soldering in this paper, to find the matching solder combination. Results show that, Sn-90Pb, Sn-95Pb solders are not the good choices for Al2O3/MoCu in vacuum soldering. Sn-3.0Ag-0.5Cu and Sn-37Pb solders can be used in the vacuum soldering, and Sn-37Pb solder is the best choice as the leaded solders for space use.

机译：SN-90PB，SN-95PB，SN-37PB焊料的散热界面反应与SN-3.0AG-0.5CU焊料对比本文的SN-3.0AG-0.5CU焊料，以找到匹配的焊料组合。结果表明，SN-90PB，SN-95PB焊料不是Al 2 O 3 / MOOCU的良好选择。 SN-3.0AG-0.5CU和SN-37PB焊料可用于真空焊接，SN-37PB焊料是作为空间使用的铅焊料的最佳选择。

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《International Conference on Electronic Packaging Technology and High Density Packaging》|2012年||共3页
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Chen Yarong; Yang Meng; Zhang Binbin; An Rong;
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1. Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging [J] . H.T. CHEN, C.Q. WANG, C. YAN, Journal of Electronic Materials . 2007,第1期

机译：Ni（Au / Ni / Cu）-SnAg-Cu焊点中的界面反应在回流焊和热时效过程中的相互作用
2. Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging [J] . H.T. Chen, C.Q. Wang, C. Yan, Journal of Electronic Materials . 2007,第1期

机译：Ni（Au / Ni / Cu）-SnAg-Cu焊点中的界面反应在回流焊和热时效过程中的相互作用
3. Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging [J] . H.T. Chen, C.Q. Wang, C. Yan, Journal of Electronic Materials . 2007,第10期

机译：Ni（Au / Ni / Cu）-SnAg-Cu焊点中的界面反应在回流焊和热时效过程中的相互作用
4. Interfacial reaction of heat-sink during vacuum and reflow soldering in space power electronics [C] . Chen Yarong, Yang Meng, Zhang Binbin, International Conference on Electronic Packaging Technology and High Density Packaging . 2012

机译：航天电力电子设备在真空和回流焊接过程中散热器的界面反应
5. Wetting behaviors and interfacial reactions of lead-containing and lead-free solder alloys on gold, palladium, nickel foils, leadframes, and under-bump thin film metallizations in electronic packaging. [D] . Kim, Patrick Gu-Ho. 1998

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Interfacial reaction of heat-sink during vacuum and reflow soldering in space power electronics

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