首页> 外国专利> Reflow soldering process for electronic circuit boards has a microwave powered preheating stage

Reflow soldering process for electronic circuit boards has a microwave powered preheating stage

机译:电子线路板的回流焊接工艺具有微波预热阶段

摘要

The electronic circuit boards [20] are continuously transferred on a conveyor [24] through the reflow soldering process [10]. The circuit boards are prewarmed by passing under a microwave heating stage [18] having a controlled frequency. The heated circuits then pass to the soldering stage [14] and finally to a cooling stage [16].
机译:电子电路板[20]通过回流焊接工艺[10]连续地传送到输送机[24]上。电路板通过在频率受控的微波加热台[18]下预热。然后,加热的电路进入焊接阶段[14],最后进入冷却阶段[16]。

著录项

  • 公开/公告号DE10316513A1

    专利类型

  • 公开/公告日2004-10-21

    原文格式PDF

  • 申请/专利权人 ENDRESS + HAUSER GMBH + CO. KG;

    申请/专利号DE2003116513

  • 发明设计人 BIRGEL DIETMAR;

    申请日2003-04-09

  • 分类号B23K3/04;H05K3/34;H05B6/64;

  • 国家 DE

  • 入库时间 2022-08-21 22:43:19

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号