Method for producing solder connection between semiconductor component and carrier element of power electronics module for e.g. hybrid car, involves arranging polyimide spacer element between semiconductor component and carrier element

摘要

The method involves arranging a spacer element (22-24,26) between a power semiconductor component (15) and a carrier element (11). The spacer element is made of polyimide material. A spacer element portion facing the power semiconductor component or the carrier element is coated with a ceramic layer. The spacer element is connected with the power semiconductor component and the carrier element through soldering process. An independent claim is included for a component assembly.