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Influence of segregation and diffusion behavior on electrical properties of embedded Ni- Cr thin film resistor

机译：偏析和扩散行为对嵌入式Ni-Cr薄膜电阻器电性能的影响

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The segregation and diffusion of Ni-Cr embedded thin film resistor (ETFR) materials under different annealing conditions were investigated. Strong segregation and diffusion were caused by annealing at high temperature. The electrical properties of Ni- Cr ETFR were affected by segregation and diffusion of metal, which led unstable TCR and large resistivity.

机译：研究了不同退火条件下Ni-Cr嵌入薄膜电阻器（ETFR）材料的偏析和扩散。高温退火导致强烈的偏析和扩散。 Ni-Cr ETFR的电性能受金属偏析和扩散的影响，从而导致TCR不稳定和大电阻率。

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《International Conference on Electronic Packaging Technology and High Density Packaging 》|2012年|p.298-301|共4页
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Lai Lifei; Sun Rong; Fu Xianzhu; Du Ruxu;
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中图分类包装工程 ; 包装工程 ;
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Influence of segregation and diffusion behavior on electrical properties of embedded Ni- Cr thin film resistor

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