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Innovative 3D system development by multifunctional IC interposer platform - signal integrity and thermal management - solutions for high performance computing

机译:多功能IC插入平台的创新3D系统开发 - 信号完整性和热管理 - 用于高性能计算的解决方案

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This paper presents specific solutions being developed for signaling and data transmission purposes specific for 3D interposer structure. The research on signal integrity parameters optimization is mutually dependent on thermal management and heat redistribution issues present within the interposer structure. It is a main objective of the CarrICool (EU FP7) project covering bundle of innovations from optical signaling, through integration technology, liquid cooling, corrosion hardness.
机译:本文介绍了用于用于3D插入结构特定的信令和数据传输目的的特定解决方案。对信号完整性参数优化的研究相互依赖于中插器结构中存在的热管理和热再分布问题。它是粉饰(欧盟FP7)项目覆盖从光学信号传导的创新束的主要目标,通过集成技术,液体冷却,腐蚀性硬度。

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