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An Investigation of Whisker Growth on Tin Coated Wire and Braid

机译:镀锡丝和编织线上晶须生长的研究

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Pure tin is a common finish for copper hook up wire, coaxial cable, ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports of whisker growth on tin coated copper wire than on other types of tin coated parts. This paper presents data from humidity- temperature conditioning and electron microscopy inspection of tin coated wire specimens of various size and age. After 4000 hours of 85°C/85%RH conditioning, some of the wires showed tin whisker growth, but the growth was very sparse with near zero density distribution and whisker lengths were typically less than 10 microns. The data indicate very lpw risk for whisker growth on tin coated copper wire, braid and cable.
机译:纯锡是用于电子组件上的铜线,同轴电缆,接地编织线束和线束组件的常用涂层。从历史上看,与其他类型的镀锡零件相比,镀锡铜线上晶须生长的报道较少。本文介绍了湿度和温度调节以及各种尺寸和年龄的镀锡金属丝样品的电子显微镜检查数据。在85°C / 85%RH的条件下放置4000小时后,某些焊丝显示出锡晶须生长,但生长非常稀疏,密度分布接近于零,晶须长度通常小于10微米。数据表明,在涂锡的铜线,编织层和电缆上,晶须生长的风险极低。

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