DRAM chips; microprocessor chips; monolithic integrated circuits; multiprocessing systems; multiprocessor interconnection networks; network routing; network-on-chip; 3D stacking DRAM; NoC architectures; asymmetric organization; in-package memory capacity; indirect network organizations; interposer overall routing capacity; memory integration; multicore chip; network-on-chip; point-to-point interconnects; routing resources; silicon interposer systems; silicon interposer technology; Bandwidth; Metals; Multicore processing; Routing; Silicon; Stacking; Topology;
机译:具有用于许多核心系统的低功率混合无线有线时钟分配网络的活性硅插入器
机译:用于大型纳米光子学的系统的自对准硅中介层和硅桥
机译:多个骰子合而为一:Silicon Interposer FPGA的CAD流程和路由架构
机译:硅中介层系统的NoC架构:为什么可以免费(从中介层获得)更多的电线呢?
机译:异渗透集成硅光子插入器的力学分析
机译:高电阻Si插入器的RF冗余TSV互连
机译:硅插入器系统的NoC架构为什么在你可以免费获得它们(从你的插入器)获得更多电线?