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Lithography at 14nm and beyond: Choices and challenges

机译:14nm及以上的光刻技术:选择与挑战

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As the gap between the lithography wavelength and critical feature size has continued to increase, the semiconductor industry has had to adjust. Previously, scaling along Moore''s Law had relied on improvement in lithography equipment, occasionally by reducing the wavelength and frequently by improving the effective numerical aperture. The wavelength used to define critical dimensions during much of the nineties was 248nm, with the industry switching to 193nm in the following decade. After 157nm technology failed to materialize due to technological challenges, the focus of next generation lithography (NGL) research shifted to EUV. Meanwhile, 193nm continued to be the workhorse for the continuation of Moore''s Law. The next big equipment advancement came with immersion steppers, which “increased” the effective aperture of the lens, thereby capturing more of the diffraction orders in the imaging process. Moore''s Law, however requires a significant innovation every two years! With optical lithography wavelength and effective lens aperture stretched to these limits, double patterning came to the rescue. By splitting the pattern into two, the burden on each mask was somewhat reduced, allowing a “stitched” pattern to scale. All through these changes, continued scaling also required a tighter co-optimization between process and design. As the image quality became generally weaker, greater restrictions were placed on the diversity of features that could be robustly patterned, leading to the proverbial increase in the heft of design rule manuals. All through these heroic efforts to continue Moore''s Law, in order to reap the resulting benefits to the electronics industry, a relatively new field called Computational Lithography has been providing a helping hand. Computational Lithography comprises a broad set of techniques that use physics-based calculations to eke out greater lithographic performance from a given generation of steppers. This --fertile field has recently introduced two advanced features: inverse lithography, and source-mask optimization. Such techniques have helped extend the life of optical lithography beyond previously forecast durations. At the same time, as other lithography technologies become more mature, much of the computational infrastructure developed to extend optical lithography will likely be used to optimize the newer technologies. This paper will provide some examples of how Computational Lithography is creating novel and affordable solutions to sustain the scaling trend
机译:随着光刻波长和关键特征尺寸之间的差距不断扩大,半导体行业不得不进行调整。以前,按照摩尔定律进行缩放需要依靠光刻设备的改进,有时是通过减小波长来实现的,而经常是通过提高有效数值孔径来实现的。在90年代的大部分时间里,用于定义关键尺寸的波长为248nm,随后的十年中该行业转向了193nm。在157nm技术由于技术挑战而未能实现之后,下一代光刻(NGL)研究的重点转移到了EUV。同时,193nm继续成为摩尔定律延续的主要力量。设备的下一个重大进步是浸入式步进器,它“增加”了镜头的有效光圈,从而在成像过程中捕获了更多的衍射级。但是,摩尔定律要求每两年进行一次重大创新!随着光学光刻波长和有效透镜孔径扩展到这些极限,双重图案得到了拯救。通过将图案分成两部分,每个掩模上的负担有所减轻,从而可以扩展“缝合”图案。通过所有这些更改,持续扩展还需要在过程和设计之间进行更严格的共同优化。随着图像质量总体上变弱,对可以进行可靠图案化的功能的多样性施加了更大的限制,从而导致设计规则手册数量的增加。通过继续英勇的摩尔定律的所有英勇努力,为了从电子工业中获得收益,相对较新的领域称为计算平版印刷术(Computational Lithography)一直在提供帮助。计算光刻技术包括多种技术,这些技术使用基于物理学的计算来从给定的步进电机中获得更高的光刻性能。这 - -- 肥沃的领域最近引入了两个高级功能:反光刻和源掩模优化。这样的技术已经帮助延长了光学光刻的寿命,使其超出了先前预测的持续时间。同时,随着其他光刻技术变得更加成熟,为扩展光学光刻而开发的许多计算基础设施将有可能被用于优化较新的技术。本文将提供一些示例,说明计算平版印刷术如何创建新颖且负担得起的解决方案以维持缩放趋势

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